Scholarship for Japan Students at Bond University on 30th Anniversary in Australia, 2019

  • Partial Funding
  • Bond University
  • Masters
  • Selected Countries
  • Australia
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Scholarship Description:

Scholarship for Japan Students at Bond University on 30th Anniversary in Australia, 2019 is open for Selected Countries . The scholarship allows Masters level programm(s) in the field of taught at Bond University . The deadline of the scholarship is .

Scholarship Description: Bond University is pleased to invite to Japanese applicants for 30th Anniversary Scholarship – Japan. This scholarship is available to Japanese students commencing either a bachelor or masters degree at Bond University in 2019 or 2020.

The programme is offering a number of part-fee scholarships to high achieving students from Japan, to commemorate the historic milestone in Japanese-Australian friendship.

Scholarship Provider: Bond University aims to help identify future leaders and realize their full potential by providing access to an exceptional educational experience. It is Australia’s first private, not-for-profit university, offering a personalised academic environment that enables graduates to exceed the outer limits of their potential.

Degree Level: Scholarships are available for the bachelor or masters degree programs

Scholarship Benefits: 50% tuition fee remission

Eligible Countries: Japan

Available Subjects: Undergraduate, Postgraduate courses are eligible for this scholarship

Eligibility Criteria: To be considered, applicants must:

  • Become a citizen of Japan and currently live in Japan.

  • Those studying English as part of the packaged offer at the Bond University College are still eligible to apply.

  • Students have received a proposal from Bond University in 2019 or 2020 for either a graduate or masters degree, either to start a package of programs including a bachelor or masters degree.

  • Students with packaged offers should start their degree in the package or before the September 2020 semester.

Application Procedure: 

Students must complete the Bond University Online Application Form to receive their program offer before applying for this scholarship.

  • The 30th Anniversary Scholarship – Japan Application Form can be downloaded at and must be completed in full and returned to [email protected] by the application closing date.

  • Bond will select the successful applicants on a competitive, merit-based process.

Eligibility Criteria:

  • Applying online to study at Bond University is free and easy. There’s no application fee – no obligation to accept a place if it is offered – it simply gives you another option when it comes to making a decision about your future.

  • For postgraduate study, the entry requirements are unique to each individual program. Search for your program of interest to find out the specific entry requirements.

Scholarships Benefits: 

  • Recipients of the 30th Anniversary – Japan Scholarship are awarded a 50% tuition remission for the duration of their chosen program.

  • For students undertaking a package of programs (e.g. English for Academic Purposes followed by a Masters degree), the scholarship will apply to the degree portion of the package only.

  • For this scholarship, awards are non-transferable and cannot be redeemed for cash

Scholarship Link

Deadline: 24 May 2019

Degree Level:

Scholarship for Japan Students at Bond University on 30th Anniversary in Australia, 2019 is available to undertake Masters level programs at Bond University.

Available Subjects:

Following subject are available to study under this scholarship program.


    Achievement Scholarships for International Undergraduate Students: Engineering and Information Technology, University of Technology Sydney


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