Temple University in USA Merit Scholarships 2023 is open for International Students . The scholarship allows Postgraduate, Undergraduate level program(s) in the field of All Subjects taught at Temple University . The deadline of the scholarship is Open.
Students are automatically considered for merit scholarships upon applying to Temple—a separate application is not needed. Submit your application for admission and all supporting documents by the application deadlines. We strongly encourage students to apply early in order to have the best chance to receive a merit award.
Temple has introduced the #WhyUS campaign and scholarships to help ensure all international students know that the U.S. is one of the most desirable places in the world to study.
These scholarships, which range from $2,000 to $10,000 for up to four consecutive years (four years for first-year students and two years for transfer students), will be awarded for the best responses to our creative prompt. Winners will be chosen independent of a prospective student’s academic performance, and scholarships can be combined with other awards already received. Scholarship winners will be announced by April 1.
Temple University in USA Merit Scholarships 2023 is available to undertake Postgraduate, Undergraduate level programs at Temple University.
Following subject are available to study under this scholarship program.
These scholarships range from $2,000 to full tuition. The availability of funding and the size, quality and characteristics of the overall applicant pool will determine the number and value of merit scholarships offered. Please note full-tuition scholarships are extremely competitive.
International Students are eligible to apply for these scholarships.
To be considered for #WhyUS scholarships, you must
Deadline
Make sure to meet the application deadline to be considered for the #WhyUS Scholarship.
The deadline to submit your enrollment deposit is May 1.
Achievement Scholarships for International Undergraduate Students: Engineering and Information Technology, University of Technology Sydney